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像素型硅探测器

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DESIGN

JUNCTION

ACTIVE AREA
(mm2)

CHIP DIMENSIONS
(mm2)

JUNCTION WINDOW

OHMIC WINDOW

WAFER
SIZE 
(inch)

PACKAGE

PIXEL ARRAY

PITCH ARRAY
(µm)

Implant

Metal

Implant

Metal

MSPX 1x1

1 x 1

1000 x 1000

1.00 x 1.00

4.00 x 20.50

2

M

2

M

4 & 6

Stackable Standard FR4

MSPX 1x16

1 x 16

1000 x 1000

1.00 x 17.50

4.00 x 20.50

2

M

2

M

4 & 6

Stackable Standard FR4

MSPX 16x16

16 x16

1140 x 1408

17.88 x 22.11

18.10 x 22.33

2

M

2

M

6

Chip Only

MSPX 10x10

10 x 10

2000 x 2000

19.90 x 19.90

25.90 x 25.90

2

M

2

M

6

Chip Only

MSPX 4x4

4 x 4

4950 x 4950

19.95 x 19.95

24.00 x 24.00

2

DM

2

M

6

Black FR4

MSPX 12x12

12 x 12

4950 x 4950

59.95 x 59.95

64.00 x 64.00

2

DM

2

M

6

Range of designs in different materials.

MSPAD 1x9

1 x 9

Variable

6.00 x 54.00

10.00 x 58.90

2/7/9

M

2

M

4

Black FR4

MSPX 042

4 x 4

10 000 x 10 000

46.00 x 46.00

60.00 x 60.00

2

M

2

M

4

Black
 FR4

MSPAD 1x4-1

1 x 4

Variable

12.00 x 48.00

16.00 x 52.00

2

M

2

M

4

Black FR4

MSPX 080

8 x 8

12 075 x 12 075

96.95 x 96.95

99.00 x 99.00

2

DM

2

M

6

Ceramic

MSPAD 1x4-2

1 x 4

Variable

16.00 x 50.00

20.00 x 54.00

2

M

2

M

4

Black FR4

MSPX 128

128 Total

Hexagon 
Flat to-Flat
8910

Ø  117.15

Ø  123.15

2/7/9

G

2

M

6

Ceramic




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